APCS – Advanced Packaging for Compound Semiconductor Applications
With the emergence of wide bandgap semiconductors (e.g. SiC, InP and GaN), the standard electronics packaging and interconnection technologies have become the limiting factor determining the performance and efficiency of the new semiconductor components. In order to achieve the dramatic improvements that are required in the performance, reliability and cost-effectiveness of future electronics systems, an integrated approach based on advanced packaging technologies of new generations of compound semiconductor devices with integrated functionality, standard interfaces, suitability for mass production and application versatility is required.
This workshop aims to bring together an array of electronics packaging experts and practitioners to present a comprehensive review of advanced packaging technologies applied to areas of power electronics, photonics, RF/Microwave and sensing, where compound semiconductors are already making an impact.